Category:PCB BGA
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.
Good day all, we are having problems with some new BGAs that are slowly filtering their way into our designs. Engineering really wants to use them and I am pressured to make them work. They are 54 bal...(view more)
Hi, I'm having a lot of problems with BGA's shorts, we are using 0.005" stencil aperture 1 to 1 (0.014)", the paste is centre (I can not measured the height)was verified using electronic microscopie, ...(view more)
Hello, recently we changed supplier of the LF BGA, we did corossection and now have doubts... previous BGA specs : pitch 1mm, ball diameter 0.6mm future BGA specs : pitch 1mm, ball diameter 0.4mm ...(view more)
Hi Everyone My company has done loads of 0402 placements but are now required to start looking at 0201 and micro BGA placements. I’ve done loads of research and I’m happy with stencil design, area rat...(view more)
BGA Rework Stations It is this week! Come and meet with the top manufacturer's in Butte County, CA. A great place for job seekers, students, and companies looking to re-locate to a more desirabl...(view more)
What do other people use to ensure that the BGA machine is within spec ie beform a weekly check and record on SPC charts? We want to start recording this can a plate or some kind of surveyor be ...(view more)
I am trying to assess current industry thinking on the question of whether or not lead-free BGAs (SAC or other) can or should be soldered in a tin/lead process. It seems there are differing opinions o...(view more)
Hi, Can anyone explain how BGA optical systems work on professional systems? What optics is used?(view more)
Does any one know how to calculate BGA height change after reflow oven?I guess the calculation will be based on the component size, weight, ball diameter and ball count of the BGA, but how to get the ...(view more)
We are about to run our first BGA devices and would appreciate some confirmation on a few points. First some details: PCB & Device: ============= 1) 16 layer (4 power, 4 gnd, 8 signal) 2) gold on ...(view more)