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Category:PCB BGA
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.
I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. The part is 1.77" square with a 50 mil pitch and 30 mil bu...(view more)
canerdurmusogluI need know the types, characteristic specials for temperature, general characteristics and all I need know about of manufacturer for BGA. I Hope than you send my information about this.(view more)
etb2.binsbergenHi all, Any stencil opening recommendation for 20mils pitch mirco BGA. Currently, using 12mils round opening, 5 mils thickness. Seen to have weak joints as it crack after Ict testing.(view more)
CareyHi all, These days our customer asks us to figure out ,during reflow,the BGA ball and solder paste,which will first melt? I think it's very hard to get the rusult.coz I think it'll vary at diffrent pa...(view more)
BoydI've a problem with a BGA. I've the impression that the balls broke then there is a too big mecanical stress on the PCB. I lost some dBm and when I press on the BGA I measure the good value! It's like...(view more)
BradyCan anybody tell me which is better; to paste to BGA or to paste to PCB? What are the pitfalls when pasting to BGA?(view more)
AdairHello all: We looking for an effective solutions for HIGH-VOLUMN BGA RE-BALLING. (i.e. cases where we got to scrap thousands of BGA modules and re-use the chip) BGA spec. (general) W: 8mm,...(view more)
BoyceHello, I'm looking for a lower end used machine that can place a 55x44mm sized bga component, placement speed is n't concern. At the moment I have only found the quad ivc to be capable although ...(view more)
CecilMARTIN Standalone BGA Reball and QFN Solder Bumping Unit. MARTIN will demonstrate the Reball / Prebump 03.1 unit at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled for Wednesday, ...(view more)
DevinHere's a good one!!! I've got a customer who is designing a small circuit board, and they want to reflow BGA solder balls directly to the bottomside of the PCB to effectively create a BGA style interf...(view more)
filippo.lalli
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