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Category:PCB BGA
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.
AIR-VAC DRS27 Large Format BGA Rework Station. Rocket EMS Inc., a Silicon Valley-based full service EMS supplier, today announced it has further enhanced its already impressive rework and specia...(view more)
greynagaDoes anyone have any "tricks" for getting all of those little pieces of paper removed from the pad/ball side of a BGA after reballing. We are using the paper preforms and there are lots of those littl...(view more)
BowenHi, we're currently running a design with a fairly simple BGA. The problem we're running into is poor solderability (cold looking joints, high voiding in the BGA). All of this on a know good oven, wit...(view more)
wolffdpHi, I encountered a problem with pbga. One edge either warp downwards or upwards creating bridging or open. This bga have fr4 at the bottom (compound molding at the top). The fr4 is bigger than ...(view more)
robladanyiDoes anyone have suggestions or observations on what my maximum board temperature should be when doing BGA repairs on an SRT? In other words, How hot is too hot? Somebody set the bottom he...(view more)
ENRICO BORSETTIWe have a ceramic BGA that the component supplier has misaligned the spheres in the fixture so they slant .007" out of alignment from the substrate pads. When the devices are tested at the component m...(view more)
kalman.kovacsOur design team is trying to change QFP into BGA. Does anyone have experience wavesoldering PCB with 0.5" pitch BGA's on the top side? What kind of problem will occure? Any advice is appreciated.(view more)
EstebanDoes anybody have information on the minimum spacing required between BGAs (i/o counts close to 696)to avoid damage during rework? Also, on the keep out requirements between CSPs (o.5 mm pitch); betwe...(view more)
EstebanWhat is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference?(view more)
GabeDoes anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/...(view more)
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