Category:PCB BGA

Group Administrators: 1 | Group Member: 97 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.;

Search Results: 97 Threads,10 Pages Post A Thread
2 comments
292 views

Rocket EMS Adds Large BGA Rework Capability

AIR-VAC DRS27 Large Format BGA Rework Station. Rocket EMS Inc., a Silicon Valley-based full service EMS supplier, today announced it has further enhanced its already impressive rework and specia...(See More)

greynaga
2017/2/2 17:13:25
4 comments
271 views

Paper Reballing Preforms

Does anyone have any "tricks" for getting all of those little pieces of paper removed from the pad/ball side of a BGA after reballing. We are using the paper preforms and there are lots of those littl...(See More)

Bowen
2017/2/2 14:48:00
3 comments
367 views

RoHS Solder Paste

Hi, we're currently running a design with a fairly simple BGA. The problem we're running into is poor solderability (cold looking joints, high voiding in the BGA). All of this on a know good oven, wit...(See More)

wolffdp
2017/2/2 13:07:19
4 comments
437 views

bga warp

Hi, I encountered a problem with pbga. One edge either warp downwards or upwards creating bridging or open. This bga have fr4 at the bottom (compound molding at the top). The fr4 is bigger than ...(See More)

robladanyi
2017/2/2 9:16:38
3 comments
460 views

Recommended max board for BGA repair

Does anyone have suggestions or observations on what my maximum board temperature should be when doing BGA repairs on an SRT? In other words, How hot is too hot? Somebody set the bottom he...(See More)

ENRICO BORSETTI
2017/2/2 8:40:32
3 comments
497 views

BGA Device with Slanted and Damaged Spheres

We have a ceramic BGA that the component supplier has misaligned the spheres in the fixture so they slant .007" out of alignment from the substrate pads. When the devices are tested at the component m...(See More)

kalman.kovacs
2017/2/2 8:04:28
5 comments
345 views

Reliability of BGA

Our design team is trying to change QFP into BGA. Does anyone have experience wavesoldering PCB with 0.5" pitch BGA's on the top side? What kind of problem will occure? Any advice is appreciated.(See More)

Esteban
2017/2/2 5:47:19
5 comments
348 views

Requirements for BGAs

Does anybody have information on the minimum spacing required between BGAs (i/o counts close to 696)to avoid damage during rework? Also, on the keep out requirements between CSPs (o.5 mm pitch); betwe...(See More)

Esteban
2017/2/2 5:35:24
5 comments
357 views

BGA and Land Patterns

What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference?(See More)

Gabe
2017/2/2 5:19:40
5 comments
386 views

Re-Balling BGA and BGA sockets

Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/...(See More)

frmendozat
2017/2/2 5:06:01