Category:Electronic Components BGA

Group Administrators: 0 | Group Member: 95 | Group Threads: 98

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Post A Thread
Search Results: 98 Threads,10 Pages
1 answers
365 views

Black pad on BGA

We have seen the black dot on the BGA pad after the component has been removed from a PCB. When most likely could this corrosion have occurred, while the component was in storage, during manufacturing... (See More)

sami
2017-02-22 06:17:10
Michal Olszak
2017-02-24 06:17:10
4 answers
284 views

BGAs

After switching from No-clean flux to Water soluble (Kester)we encountered voids problem (X-ray and microsectioning). Reducing the apperture sizes made the voids smaller but did not eliminate them. So... (See More)

avonchia
2017-02-21 12:46:33
Bradley
2017-02-23 12:46:33
5 answers
309 views

Water Soluble for No Clean BGA Balls

Hi Guys, Thanks for all your informative replies. I do know that Motorola is using a No Clean Eutectic Solder for their BGA's. We are in Aerospace and is using a Water Soluble Paste Flux. ... (See More)

Cash
2017-02-03 00:08:26
Hector Jose
2017-02-05 00:08:26
5 answers
284 views

X-Ray Recommendations

Hi, We place BGA, but until now have not used X-Ray inspection, and it would be a good thing to have. Can anyone recommend a low cost X-Ray that would get us by. We don't need something fast, bu... (See More)

Carter
2017-02-02 23:55:39
Jeronimo F Atencio
2017-02-04 23:55:39
5 answers
356 views

BGA Solderability Standard

It's been a while since BGA usage become widespread. Ton's of articles had been written with regards to design, processing, techniques, inspection etc...but it seems like there's still no hard ground ... (See More)

Daniel Gilbert
2017-02-02 23:40:29
Oguz AGCELI
2017-02-04 23:40:29
4 answers
291 views

X-Ray Criteria for BGA Solder Ball

Hi, What's the maximum and minimum solder void that can be accepted during X-ray? What about the percentage of Ball Roundness? (See More)

Byron
2017-02-02 23:27:52
tony165
2017-02-04 23:27:52
4 answers
356 views

Phosphorus Crystal Formation

We are having intermittent faults with BGA's soldered onto an immersion gold finish board with snpb solder. One potential cause I have been informed is the formation of phosphorus crystals. As I am no... (See More)

Tony Stamm
2017-02-02 20:41:48
Darren
2017-02-04 20:41:48
5 answers
309 views

BGA reflow on bottomside

Hi all, I have never had to run a product with BGAs on the bottomside of a double sided board. I was just wondering if this is a done thing ? or should I stay well clear. any replies appre... (See More)

Eugene Shamaev
2017-02-02 20:27:03
Francisco Javier
2017-02-04 20:27:03
5 answers
280 views

Lead-Free BGA Rework

I have been trying to rework a lead-free BGA. For some reason, when I remove the BGA the corner pads on the board come off and the board must be scrapped. If I do manage to remove the BGA successfully... (See More)

ISA, s.r.o.
2017-02-02 19:45:48
Cleber Toss Hoffmann
2017-02-04 19:45:48
5 answers
375 views

Thermal Relief BGA pad design traces

Is there some good resources (.pdfs, websites, articles) that someone can point me to regarding design for bga footprints? I need to brush up on thermal relief design for bga footprints. I got a custo... (See More)

Holger S.
2017-02-02 18:52:22
Cliff
2017-02-04 18:52:22
Post A Thread
Search Results: 98 Threads,10 Pages