BGA Group - Page 5

Category:PCB BGA

Group Administrators: 1 | Group Member: 102 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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Search Results: 97 Threads，10 Pages Submit Project

5 comments

935 views

uBGA rework and X-Ray inspection

Hello - I am currently evaluating uBGA rework and X-Ray inspection solutions. I would like any advice/warnings etc. regarding suppliers and equipment. I have already researched through the threads in ...(view more)

tom

2017/2/27 6:16:12

5 comments

805 views

BGA Reliability

Hi Does anyone know of any studies carried out comparing long term reliability of BGAs with their equivalent QFPs etc. If you were designing a critical product in the aerospace field would...(view more)

babinyecz

2017/2/27 4:30:33

5 comments

945 views

SMT fine pitch or BGA component

Problem: A SMT fine pitch or BGA component needs to be baked due to MS concerns and is needed in a hurry. In some cases the packaging will not allow a high temp/short duration bake. Production will no...(view more)

Laszlo Toth

2017/2/27 4:11:15

5 comments

898 views

LF BGA Tests

What kind of destructive testing is anyone doing for LF BGAs?(view more)

vitri.angelo

2017/2/27 1:36:36

5 comments

965 views

Lead free BGA

Good Morning Everyone, I had a question regarding the use of a lead free BGA in a leaded process. All of the information I have gathered from various seminars state that this is OK. It will proc...(view more)

nestandart

2017/2/27 1:25:07

4 comments

968 views

BGA station

Hi i'd like to know if i can find another thing like this station : zhuomao zm6200 with optical alignment and camera to pick/place BGA or other component. Because people told me that is a chineese cop...(view more)

Tzipiripi

2017/2/26 17:35:39

5 comments

878 views

Via in Pad for BGAs

Does anyone have any experience with via in pad for BGAs using conventional thru hole technology?(view more)

hisham.i

2017/2/26 8:25:17

3 comments

955 views

BGA Pad Cratering

This is from a section of an ALtera EP2SGX130-5 STRATIX 2 leadfree 1,508 ball BGA. What can be causing this? It is from an unused board (not assembled in a unit, or in the field, but it did pass elect...(view more)

aesistemas

2017/2/26 7:54:23

1 comments

822 views

BGA Stencil Aperture Design

Hi All, Just a quick question in relation to BGA Stencil Aperture Design - We currently use 1:1 ratio - are there any rules or benefits from over printing the PCB Pad ? Replies appre...(view more)

theubo

2017/2/25 22:57:32

1 comments

849 views

Black pad on BGA

We have seen the black dot on the BGA pad after the component has been removed from a PCB. When most likely could this corrosion have occurred, while the component was in storage, during manufacturing...(view more)

sami

2017/2/22 6:17:10

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