I have a question regarding post cured property of SMT adhesive.
If after component placement, the epoxy dot gets compressed and bridges between the 2 pads, what would the impact on the circuitry? Would it pose risk for flux entrapment? Could the cured epoxy introduce any impedance to the circuit and lead to test failure?
Raymond
2017/2/4 0:22:20
Really helpful.
Byron
2017/2/4 0:22:20
Excellent work. I am impressed.
Sotiris Katsis
2017/2/4 0:22:20
I am happy that you shared this helpful information with us.Please keep us up to date like this.
eakkarach
2017/2/4 0:22:20
Great help to my new project.
Waelson Negreiros
2017/2/4 0:22:20
Awesome post. Like it very much.