Category:PCB Assembly SMT Stencil

Group Administrators: 1 | Group Member: 40 | Group Threads: 37

The purpose of an SMT stencil is to transfer solder paste to a bare circuit board. Before the assembly of the SMT components solder paste is printed onto the component pads of the printed circuit board by stencil, which are today usually manufactured from steel, more rarely from nickel or polyimide.

Thread Reply
Pump Stencil Reply 2017-02-01 21:23:16
302 views
4 comments
13 likes

zvonimir

Leave A Message

Follow

Hi
I know that pump stencil technology can be used to print adhesive on boards with TH components already placed and clinched, but what about solder paste? The production sequence goes like this: First the jumper wires are placed and clinched with an odd-form assembly cell, then the boards are inverted and run through an SMT line consisting of a dispenser, SMD mounters and reflow oven. With a dispenser we are able to deposit a sufficient amount of solder paste on the pads so that the clinched leads do get soldered, but it is slooow. The whole business of dispensing solder paste on a panel with lots of components really slows the line down. So I was wondering if the pump stencil technology could be applied to solder paste as well, in order to get a large lump of paste on the TH joints but without getting too much of it on the SMD pads.
13 likes
Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

sakchaisiri

Leave A Message

Follow

What you share on your post is quite useful.

Gustavo Santaolalla

Leave A Message

Follow

Remarkable.It help me a lot. Thank you.

Michele Deligio

Leave A Message

Follow

Truly enjyed reading your posts.

Abner

Leave A Message

Follow

I certainly enjoyed reading your post.
ThreadReply