Category:PCB Assembly SMT Stencil

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The purpose of an SMT stencil is to transfer solder paste to a bare circuit board. Before the assembly of the SMT components solder paste is printed onto the component pads of the printed circuit board by stencil, which are today usually manufactured from steel, more rarely from nickel or polyimide.

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Latest Technology for Stencil Foil Reply 2017-02-01 16:16:22
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julien.brasart

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Hi everybody, Is there any input on the latest techs for stencil foil? Something like Invar, Nano Protek, nickel electroform etc.
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My favorite psot here. Its very impressive and helpful.

gcasarrubias

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I have learned a lot from your article. Quite useful and impressive info.

Borg

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I am so glad that you shared this useful information with us. It is pretty helpful.Hope you can write again.
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