Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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Reliability of BGA Reply 2017-02-02 05:47:19
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Esteban

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Our design team is trying to change QFP into BGA. Does anyone have experience wavesoldering PCB with 0.5" pitch BGA's on the top side? What kind of problem will occure? Any advice is appreciated.

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Charles

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I will keep on reading your sharing. Thats really interesting and helpful.

Chapman

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It was truly informative. Your post is very useful.Many thanks for sharing!

Carter

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A good and help piece of info.

Lesley Manley

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Quite useful and impressive info.Thanks for marvelous posting.

Robo Car

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Like this post very much.
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