Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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Requirements for BGAs Reply 2017-02-02 05:35:24
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Esteban

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Does anybody have information on the minimum spacing required between BGAs (i/o counts close to 696)to avoid damage during rework? Also, on the keep out requirements between CSPs (o.5 mm pitch); between CSPs and BGAs.
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Eden

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Marvelous!

kasemkwang

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Very interesting post.

Vojtek Gábor

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I have learned a lot from your article. Quite useful and impressive info.

grzes91

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Very helpful and valuable.

reilhacpierre

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Excellent work. I am impressed.
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