Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA step by step Reply 2017-02-02 04:51:21
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etb2.binsbergen

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I need know the types, characteristic specials for temperature, general characteristics and all I need know about of manufacturer for BGA.
I Hope than you send my information about this.
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Calvin

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A good and help piece of info.

Franco Piccirelli

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Remarkable.I have learned a lot from your post.

Luis Moreno

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Good resource for new beginners.

j.rattanavongsa

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I appreciate your article very much. Wait for your next writing.
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