Category:Electronic Components BGA

Group Administrators: 1 | Group Member: 95 | Group Threads: 98

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Thread Reply
large bga capable placement machines Reply 2017-02-02 00:43:25
273 views
5 comments
22 likes

Cecil

Leave A Message

Follow

Hello, I'm looking for a lower end used machine that can place a 55x44mm sized bga component, placement speed is n't concern.
At the moment I have only found the quad ivc to be capable although I'm worried about the placement accuracy and repeatability numbers of this machine.
I like the look of the mydata tp9-ufp but I'm not sure if this machine can handle the size although the newer machines do.
The component is n't actually a semiconductor but a pga to bga 754pin zif socket, 1.27mm pitch outer dimension ~55mmx44mm and inner bga grid ~35mmx35mm.
Any of your thoughts are appeciated.
22 likes
Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

Alva

Leave A Message

Follow

My friends and I have learned a lot with your post. And we will keep on following you for the further study.Hope your next article will come soon.

javier mainar val

Leave A Message

Follow

I have learned a lot from your article. Quite useful and impressive info.

mikenaly

Leave A Message

Follow

Really appreciate your content. It quite benefits my learning and it has solved my puzzles completely. Thanks.

michal.kozlok

Leave A Message

Follow

You did a great job. Really appreciate your content.

Blake

Leave A Message

Follow

Please keep us up to date like this.
ThreadReply