Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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Reflowing BGA balls to a PCB surface Reply 2017-02-02 00:04:55
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filippo.lalli

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Here's a good one!!! I've got a customer who is designing a small circuit board, and they want to reflow BGA solder balls directly to the bottomside of the PCB to effectively create a BGA style interface between his PCB and another PCB. Anybody ever done this before? I think it sounds exciting, but never having done much reballing, I have some serious concerns. What kinds of questions should I be asking my customer?
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sergio

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A good piece of info for learning.

Francisco

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A good piece of info for learning.

wolffdp

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Appreciate your sharing.Please keep up your updates.

gyula.loosz

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Inictllgenee and simplicity – easy to understand how you think.

Bing

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Wow, these helpful info benefit me a lot. Great thanks to you.
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