Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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45 mil ball diameter BGA Reply 2017-02-01 23:59:49
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Cleveland

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Good day all, we are having problems with some new BGAs that are slowly filtering their way into our designs. Engineering really wants to use them and I am pressured to make them work. They are 54 ball BGAs. The pitch is .8 mils and the ball diameter is .45 mils. The package is 16 x 8 mils. Now I know there are probably much worse challenges out there but we are having issues getting consistantly accurate places from the P&P. Also I am seeing issues with paste clogging and not transfering to the PCB during the stenciling process. We are using a 5 mil thick stencil with 1:1 aperture to pad size. Any recomendations?
There is a TSOP version of this part that I am trying to get engineering to switch to to save me some headaches but in the meantime i need to make the best of what ive got.

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Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

Fredrick Lantz

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Please keep doing your great job.

Antal Levente

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Useful!

mehran

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Great work. I really appreciate it.

Juan Pablo Vales

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Remarkable.I have learned a lot from your post.

yesyes

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I was really confused, and this answered all my qutoiesns.
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