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Capability
Standard Capability Advanced Special Capability PCBA Capability
PCB Fabrication
HDI PCB

ALLPCB Advanced Special Capability

Item

Brand/Specifications

Remark

Material

FR-4

Normal TG

ShengyiTenghui(Taiwan Brand)


Medium TG

ShengyiTenghui(Taiwan Brand)


High TG

ShengyiTenghui(Taiwan Brand)


HF

Medium TG

Shengyi


High TG

Shengyi


Ceramic filled high frequency board

Rogers4003/4350Arlon25N/25FR


PTFE high frequency board

Rogers seriesArlon series

Taconic seriesTaiZhou Wangling


Special PP

Rogers4450Arlon25FRArlon 49N

Arlon6700Taconic FR-27


Rigid PI

Arlon85NShengyi SH260


Metal PCB

Bergquist Alu. Domestic Alu,Copper base board


Layers

FR-4

40-layer


HDI

24-layer


Rigid-Flexible

 

 

16-layer


High-frequency Multilayer

24 -layer


PTFE

12-layer


Metal

Sandwich Board

4-layer


Trace width/space

Inner Layer

3mil3mil0.5OZ base copper


4mil4mil1OZ base copper


5mil6mil2OZ base copper


7mil8mil3OZ base copper


8mil10mil4OZ base copper


Outer  Layer

3mil3mil1/3OZ base copper0.5OZ base copper


5mil5mil1OZ base copper


6mil7mil2OZ base copper


7mil8mil3OZ base copper


8mil10mil4OZ base copper


Item

Specifications

Remark

Drill

Min.  merchanical drilling size

0.15mm


Min.laser blind drilling size

0.10mm


Ratio  of thickness to via size

12:1


Min. annular ring

3mil


Min. annular ring for component hole

6mil


Min.via space(same network)

0.20mm


Min. via space(different network)

0.35mm

consider aboutCAF

Min. space for component holes

0.70mm


Inner vias to copper distance

7mil


Min. half hole

0.4mm


Via in pad or  resin plugged  via diameter

0.10-0.6mm


Tolerance

Via diameter tolerance

±3mil(PTH)


±2mil(NPTH)


±2mil(pressfit hole)


Dimension tolerance

±0.10mm


Slot size tolerance

±0.10mm


Impedance control value tolerance

±8


Board thickness tolerance

±8%(board thickness1.0mm)


±0.10mm(board thickness1.0mm)


Deep drilling via tolerance

±0.10mm


Trace width tolerance

±2miltrace width10mil)


±20%( trace width10mil)


Item

Specifications

Remark

Surface finish

Immersion gold

Max. gold thickness

8u"


Hard gold

Max. gold thickness

2.0um


Immersion tin

Tin thickness

0.8-1.2um


Immersion silver

Silver thickness

0.15-0.25um


OSP

Film thickness

0.2-0.5um


Hasl with lead/Hasl lead free

Tin thickness

2-40um


Board thickness

0.6mmH3.0mm


Others

Bow and twist

0.5%


Soldermask bridge

IC space(green oil)

7mil


IC space(oil with other color)

8mil


Copper thickness

Inner layer

12OZ


Outer layer

15OZ


Drilling times for mechanical blind vias

3 times


Board thickness

Max. thickness

6.8mm


Min. thickness

0.2mmdouble-sided


For more special capability, please refer to your dedicated sales