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3D DRAM Roadmap and Production Timeline
3D DRAM emerging as an alternative to HBM for AI: vendor roadmaps, capacitor-free concepts, performance benefits and market outlook.
Hybrid Bonding to Debut with HBM4E
SK Hynix pioneers hybrid bonding in HBM4E, enhancing bandwidth, efficiency, and memory integration for AI and high-performance computing.
Storage Chip Prices Surge in 2025
Storage chip prices surge in 2025 due to AI demand and supply cuts by SanDisk, Micron, and Yangtze Memory. Read more on market impacts.
Stellar MCU Redefines Storage for SDV
Stellar MCU with xMemory redefines storage for SDVs, offering scalable, efficient solutions for automotive software complexity.
SanDisk Raises NAND Prices Over 10% in 2025
SanDisk raises NAND flash prices over 10% in 2025 due to supply constraints and AI demand, signaling market recovery and innovation.
PCIe 7.0 Final Draft Hits 128 GT/s
PCIe 7.0 final draft hits 128 GT/s, doubling PCIe 6.0 speed for AI, data centers, and high-performance computing with optical innovations.
AI Storage Trends: QLC and SSDs Surge in 2025
Explore AI storage trends for 2025, focusing on QLC NAND, enterprise SSDs, and growth in AI servers, smartphones, PCs, and automotive.
DDR4 Phase-Out Shakes Up Memory Market
DDR4 phase-out by 2025 shakes memory market as Samsung, SK Hynix, and Micron shift to DDR5 and HBM, creating opportunities for others.
3D NAND Hits 400+ Layers with Hybrid Bonding
3D NAND exceeds 400 layers with hybrid bonding. Samsung adopts Yangtze Memory¡¯s Xtacking for V10 NAND, boosting density and performance.