RF Power Amplifiers in Textile Composite Research

Nonlinear ultrasonic evaluation of porosity in RTM textile composites: methods, pulse?train excitation, transducer selection, FFT harmonic analysis and system design.

Mercedes E260L Air Quality Sensor Failure Diagnosed

Diagnostic case of a Mercedes E260L where LIN bus oscilloscope decoding pinpointed a failed in-cabin particulate sensor (B31/4) causing PM2.5 display loss; sensor replaced.

DIY Infrared Thermal Camera Using ESP32

DIY thermal camera using ESP32 and MLX90640: 32x24 IR sensor, 2.4" TFT display, USB battery charging with power-path switching, KiCad schematics, PCB and 3D models.

Memory Alignment in ARM Embedded Systems

Technical overview of memory alignment in embedded systems: reasons, ARM/MMU requirements, atomicity, NEON constraints and cache-line effects on performance.

Redis Distributed Locks: Five Approaches

Explains Redis-based distributed lock strategies—from SETNX to atomic SET with EX/PX, unique owner IDs, and Lua scripts—to prevent cache stampede.

C Language Data Types Explained

Overview of C data types, variables, integer/float/char representations, memory sizes and IEEE?754 layout, plus implicit and explicit type conversion rules for C.

DC Startup Environment and Synthesis Procedure

Guide to configuring Synopsys Design Compiler startup: using .synopsys_dc.setup, defining target/link/symbol/synthetic libraries, startup modes, synthesis workflow and DC commands.

Linux TCP Queue Parameters Explained

Practical guide to Linux TCP tuning from server perspective: connection queues, receive/send buffers, Ring Buffer, QDisc, NIC multi-queue and offload settings.

Kubernetes CoreDNS: What it is and how to monitor

Guide to monitoring CoreDNS in Kubernetes: configure Prometheus to scrape CoreDNS metrics, and monitor errors, latency, traffic, saturation and cache performance.

30 Common Linux Interview Questions

Concise guide to common Linux interview questions covering system administration, core commands (rm, ps, grep, tar), kernel components, LVM, bonding modes, and troubleshooting.