ALLPCB
How Is Film Thickness Measured in Chip Fabrication?
Learn thin film thickness measurement: four-point probe, ellipsometry & XRF to optimize semiconductor performance, yield and reliability.
How Difficult Is Chip Development? Four Design Steps
Overview of chip design flow: market requirements, architecture, front-end RTL and verification, plus back-end physical implementation and EDA tools.
Low-Power Techniques in IC Design and Design Flow
Low-power IC design techniques—voltage/clock management, power gating, sleep modes—and IC design flow from front-end to mass production.
Features and Uses of Four IC Packaging Types
Explore the features and uses of four IC packaging types: DIP, SOP, COB, and BGA, crucial for chip protection and performance.
Key Factors Impacting Chip Performance
Explore key factors like process technology, architecture, and manufacturing that impact chip performance and efficiency.
IC Chip Design with Copper Interconnects
Learn how copper interconnects, low-k dielectrics, SOI, and HKMG enable reliable, high-performance 32/28nm CMOS scaling and advanced lithography.
Types of EDA Synthesis and Logic Synthesis Principles
EDA synthesis: converting HDL into optimized logic netlists. Learn types—logic, timing, physical, and power optimization—for IC design.
Hierarchy in Managing Chip Design Complexity
Explore how structural hierarchy manages chip design complexity with a divide-and-conquer approach, addressing capacity and teamwork.
Is IC Design the Same as Chip Design? Digital IC Flow & Tools
IC design explained: chip design process, digital IC flow, EDA tools, and design vs verification.
Ansys Supports Signoff for Intel 16nm Process
Ansys power-integrity and multi-physics tools (Redhawk-SC, Totem, PathFinder-SC) support PI, SI and reliability signoff for Intel 16nm.