ALLPCB
Xilinx FPGA BGA: NSMD vs SMD Pad Differences
Guide to Xilinx BGA pitches (1.0, 0.92, 0.8, 0.5mm): PCB layer estimation, NSMD vs SMD pads, via planning and routing tips.
IC Design vs Chip Design: Key Differences
IC design explained: stages, CAD tools, verification, packaging, goals and applications from consumer electronics to automotive and medical devices.
Why Chip Design Is So Challenging
Explore chip design challenges: architecture, verification, tape-out costs, and rising demands from AI, 5G, and automotive electronics.
EDA Expands Beyond Chip Design
EDA evolves beyond chip design, integrating AI/ML and multi-physics simulation for trillion-dollar markets in system design and digital twins.
Single-Bit Clock-Domain Synchronization via Handshake
Single-bit sync across clock domains: handshake methods, pulse-loss issues, failure detection, plus Verilog examples for reliable transfers.
Why Is Chip Design So Difficult?
Explore chip design challenges from architecture to tape-out and verification, including frontend/backend, floorplanning and first-silicon testing.
Collaborative Design from EDA to Advanced Packaging
Advanced packaging trends: fan-out, interposers, hybrid bonding, dense interconnects, thermal/mechanical reliability and EDA-OSAT collaboration.
Digital Chip Design Flow
Explore digital IC design flow: front-end logic, mid-stage DFT, and back-end physical design steps from RTL to tape-out.
Difference Between Scan and BIST in Chip Test Design
Learn Scan and BIST DFT techniques for chip testability: scan paths, scan chains, LBIST/MBIST and built-in self-test benefits.
Half-Duplex vs. Full-Duplex in Chip Design
Explore half-duplex vs. full-duplex in chip design, their differences, applications, and impact on communication systems.