ALLPCB
Xilinx FPGA BGA: NSMD vs SMD Pad Differences
Guide to Xilinx BGA pitches (1.0, 0.92, 0.8, 0.5mm): PCB layer estimation, NSMD vs SMD pads, via planning and routing tips.
IC Design vs Chip Design: Key Differences
IC design explained: stages, CAD tools, verification, packaging, goals and applications from consumer electronics to automotive and medical devices.
Why Chip Design Is So Challenging
Explore chip design challenges: architecture, verification, tape-out costs, and rising demands from AI, 5G, and automotive electronics.
EDA Expands Beyond Chip Design
EDA evolves beyond chip design, integrating AI/ML and multi-physics simulation for trillion-dollar markets in system design and digital twins.
Single-Bit Clock-Domain Synchronization via Handshake
Single-bit sync across clock domains: handshake methods, pulse-loss issues, failure detection, plus Verilog examples for reliable transfers.
Why Is Chip Design So Difficult?
Explore chip design challenges from architecture to tape-out and verification, including frontend/backend, floorplanning and first-silicon testing.
Collaborative Design from EDA to Advanced Packaging
Advanced packaging trends: fan-out, interposers, hybrid bonding, dense interconnects, thermal/mechanical reliability and EDA-OSAT collaboration.
Digital Chip Design Flow
Explore digital IC design flow: front-end logic, mid-stage DFT, and back-end physical design steps from RTL to tape-out.
Difference Between Scan and BIST in Chip Test Design
Learn Scan and BIST DFT techniques for chip testability: scan paths, scan chains, LBIST/MBIST and built-in self-test benefits.
Half-Duplex vs. Full-Duplex in Chip Design
Explore half-duplex vs. full-duplex in chip design, their differences, applications, and impact on communication systems.
How Is Film Thickness Measured in Chip Fabrication?
Learn thin film thickness measurement: four-point probe, ellipsometry & XRF to optimize semiconductor performance, yield and reliability.
How Difficult Is Chip Development? Four Design Steps
Overview of chip design flow: market requirements, architecture, front-end RTL and verification, plus back-end physical implementation and EDA tools.
Low-Power Techniques in IC Design and Design Flow
Low-power IC design techniques—voltage/clock management, power gating, sleep modes—and IC design flow from front-end to mass production.
Features and Uses of Four IC Packaging Types
Explore the features and uses of four IC packaging types: DIP, SOP, COB, and BGA, crucial for chip protection and performance.
Key Factors Impacting Chip Performance
Explore key factors like process technology, architecture, and manufacturing that impact chip performance and efficiency.
IC Chip Design with Copper Interconnects
Learn how copper interconnects, low-k dielectrics, SOI, and HKMG enable reliable, high-performance 32/28nm CMOS scaling and advanced lithography.
Types of EDA Synthesis and Logic Synthesis Principles
EDA synthesis: converting HDL into optimized logic netlists. Learn types—logic, timing, physical, and power optimization—for IC design.
Hierarchy in Managing Chip Design Complexity
Explore how structural hierarchy manages chip design complexity with a divide-and-conquer approach, addressing capacity and teamwork.
Is IC Design the Same as Chip Design? Digital IC Flow & Tools
IC design explained: chip design process, digital IC flow, EDA tools, and design vs verification.
Ansys Supports Signoff for Intel 16nm Process
Ansys power-integrity and multi-physics tools (Redhawk-SC, Totem, PathFinder-SC) support PI, SI and reliability signoff for Intel 16nm.