Power Conversion Solutions for Low-Power Wireless Devices

Review of design requirements and ADI power conversion ICs for medical wearables, focusing on energy harvesting, ultra-low-power DC/DC converters and battery-extension techniques.

How IoT Will Enable Future Wearable Devices

Overview of how IoT enables wearables and smartwatches, tracing device evolution, technical challenges, and future use cases in healthcare, enterprise, and M2M.

TPS631000 for Efficient, Compact Wearable Designs

Technical overview of TI TPS631000 buck-boost converter for wearables: 1.6–5.5V input, 1.2–5.3V output, 8μA quiescent current, compact SOT-583 package.

Why Network Slicing Is Needed

Explains 5G network slicing: virtualized end-to-end slices across RAN, core and transport, enabled by SDN/NFV with resource scheduling, isolation and security.

From Wearables to Medical Devices

Technical overview of ADI's GEN II wearable platform: wrist/patch design integrating ECG, PPG, EDA, bioimpedance, motion and temperature with ADuCM3029 MCU for multimodal sensing.

Digital Therapeutics for Home-Based Self-Care

Overview of digital therapeutics: evidence-based software interventions integrating wearables, sensors, and clinical workflows to prevent, manage, and treat disease.

How to Choose and Configure a 5 GHz Router

Guide to selecting and configuring a 5 GHz router: criteria for Wi?Fi 6 hardware, antennas, channels, security and basic setup steps.

What Is Satellite Internet? Components and Uses

Overview of satellite internet: system components, LEO constellations, application scenarios, deployment status, and trends in spectrum competition and terrestrial integration.

3CC: Three-Carrier Aggregation in 5G-A

Technical overview of 3CC three?carrier aggregation: principles, deployment schemes, device support, performance gains and applications for high?throughput scenarios.

High-performance supramolecular hydrogel for thermocells

PNAGA-F68 supramolecular hydrogel thermocell delivers high ionic conductivity, robust mechanics, and NIR-II photothermal response for light-remote self-powered sensing.

5G-based AI Visual Inspection for Industry

Overview of a 5G-based industrial AI visual inspection system: architecture, MEC deployment, on-site equipment, platform-based algorithms and testing for multi-point factory inspection.

PMICs Enable Compact, High-Efficiency Designs

Technical overview of SIMO PMICs for wearables: single-inductor multiple-output DC-DC converters, design trade-offs vs LDOs/inductor regulators; examples MAX77650 & TPS65135.

Direct-Ink-Writing 3D-Printed Bioelectronics

Review of direct-ink-writing 3D-printed bioelectronics: materials, ink formulations, wearable and implantable devices, challenges and scalable manufacturing.

Understanding 5G RedCap Technology

MIIT roadmap for 5G RedCap: standard evolution, industrial ecosystem and city-level coverage by 2025, enabling scalable RedCap applications in industry and IoT.

Methods to Improve MIMO Port Isolation

Overview of three MIMO isolation decoupling methods—ground-slot, ground-stub, and neutralization-line—covering design trade-offs, resonance tuning, and implementation constraints.

1.2mm x 1.0mm Miniature Crystal Oscillators: Techniques and Benefits

Technical overview of implementing 1.2mm x 1.0mm crystal oscillators, covering material selection, packaging, electrode techniques, frequency trimming, thermal management.

High-Low Frequency Networking in 5G: Purpose and Function

Technical overview of high-low frequency networking in 5G: using TDD NR for capacity and FDD NR with SUL to improve uplink coverage, DSS coexistence, and device support.

SN74LV240A 8-Bit Buffer/Driver Datasheet

Overview of Texas Instruments SN74LV240A 8-bit buffer/driver: two 4-bit inverting drivers, VCC 2–5.5 V, mixed?mode I/O, low propagation delay and Ioff hot?insertion support.

Qorvo Low-Power PMIC for Medical Wearables

Overview of PMIC design for compact wearables, comparing Qorvo's ACT81460 and Maxim's MAX20310; emphasis on low quiescent current, SIMO topology, and small WLCSP/WLP packages.

Little Genius Q1A teardown reveals UNISOC W317

Teardown of the Little Genius Q1A kids' smartwatch detailing mainboard layout, UNISOC W317 UWS6131 chipset, power management, waterproofing and AI-assisted positioning.