Direct-Ink-Writing 3D-Printed Bioelectronics
Review of direct-ink-writing 3D-printed bioelectronics: materials, ink formulations, wearable and implantable devices, challenges and scalable manufacturing.
Review of direct-ink-writing 3D-printed bioelectronics: materials, ink formulations, wearable and implantable devices, challenges and scalable manufacturing.
Summary of Qualcomm's Release 18 contributions to 5G Advanced: uplink and broadband enhancements, IoT extensions, efficient system design, and wireless AI foundations.
Technical overview of wearable patient monitors and remote patient monitoring covering battery life, portability, patient safety, secure wireless transmission and integration.
Overview of how IoT enables wearables and smartwatches, tracing device evolution, technical challenges, and future use cases in healthcare, enterprise, and M2M.
Technical overview of Bluetooth evolution culminating in Bluetooth 5.2 and LE Audio, detailing protocol milestones and applications in IoT and audio.
Technical overview of power amplifiers in wearable devices: enabling improved audio, sensor drive and Bluetooth connectivity, with constraints on size, efficiency and battery life.
Overview of three MIMO isolation decoupling methods—ground-slot, ground-stub, and neutralization-line—covering design trade-offs, resonance tuning, and implementation constraints.
Review of microneedles design, fabrication, sensing, and transdermal delivery; covers wearable integration, stimuli-responsive systems, skin-penetration and biofouling issues.
Teardown of the Little Genius Q1A kids' smartwatch detailing mainboard layout, UNISOC W317 UWS6131 chipset, power management, waterproofing and AI-assisted positioning.
Guide to using the CYW43012 SDIO Wi-Fi/Bluetooth module on an evaluation board: hardware connections, 1.8V SDIO setup, BSP configuration and build steps.
Flexible PEDOT:PSS/AuNPs micropyramid immunosensor enabling sub-femtomolar electrochemical detection of salivary progesterone and estradiol for at-home monitoring.
Overview of PMIC design for compact wearables, comparing Qorvo's ACT81460 and Maxim's MAX20310; emphasis on low quiescent current, SIMO topology, and small WLCSP/WLP packages.
Overview of flexible printed circuits (FPC): common non-metal die-cutting auxiliary materials—FR-4, polyimide tape, TPX resist, EMI shielding film, and conductive adhesive.
Technical summary of South Korea's policy and licensing for private 5G, detailing 28 GHz deployments, licensees, and enterprise self-deployment including Samsung.
Overview of wearable devices: form factors, capabilities, market trends, and integration with 5G and industrial IoT, emphasizing smartwatches and ear-worn devices
White paper detailing ADI wearable signal-chain solutions for vital-sign monitoring, covering PPG, ECG, impedance, multi-parameter AFEs and 20 recommended components.
iFixit teardown translation of the iPhone 15 Pro Max: internal design, USB?C, A17 Pro, titanium frame, camera and battery analysis, and repairability impacts.
Overview of vital signs monitoring techniques and sensor signal chains, covering optical measurements, bioelectric/bioimpedance, MEMS sensors, and ADPD4000 front ends.
MIIT roadmap for 5G RedCap: standard evolution, industrial ecosystem and city-level coverage by 2025, enabling scalable RedCap applications in industry and IoT.
Technical guide to reducing display power in wearables: optimizing frame buffer memory, controller integration, and low-power serial memories (Quad SPI F-RAM)