iPhone 15 Series Teardown Highlights

iFixit teardown translation of the iPhone 15 Pro Max: internal design, USB?C, A17 Pro, titanium frame, camera and battery analysis, and repairability impacts.

Two Stages of Beamforming

Overview of directional transmission and beamforming in IEEE 802.11ad: sector-level sweep (SLS) and beam refinement protocol (BRP) for 60 GHz links.

ROHM 1608 SWIR LED and Photodiode Components

ROHM establishes mass-production for ultracompact SWIR emitters and photodiodes in 1608 packages (1.6×0.8 mm), enabling material sensing in wearables, hearables, and portable devices.

Flexible Wearable Textile Sensors

Comprehensive review of fabrication methods and sensing mechanisms for textile-based strain sensors (1D fibers/yarns and 2D fabrics), with resistive models.

All-Carbon Piezoresistive Sensor for Wearable Applications

Wearable all-carbon piezoresistive sensor using double-sided pyramid graphene aerogel achieves 37.3 kPa^-1 sensitivity and 0-1.4 MPa linear range for health monitoring

Single-Point Fingertip Pulse for Arterial Stiffness

Single-point heart-to-fingertip PWV (hfPWV) measured with an ion-electronic flexible pressure sensor for continuous PWV monitoring and arterial stiffness assessment.

Wearable Sweat Biosensor for Continuous Glucose

Wearable electrochemical sweat biosensor uses laser-induced graphene (LIG) and microfluidic mesh for noninvasive continuous glucose monitoring with pH/temperature calibration.

What Is Satellite Internet? Components and Uses

Overview of satellite internet: system components, LEO constellations, application scenarios, deployment status, and trends in spectrum competition and terrestrial integration.

FPGA, ASIC and RFSoC in 5G Systems

Analysis of RFSoC integration and FPGA vs ASIC trade-offs for 5G RRUs, covering DFE/ADC-DAC integration, power and thermal limits, and deployment flexibility.

Vapor Chambers for 5G Thermal Management

Technical overview of vapor chamber development for thermal management, covering wick structures, materials, and high heat?flux performance and limits.

3CC: Three-Carrier Aggregation in 5G-A

Technical overview of 3CC three?carrier aggregation: principles, deployment schemes, device support, performance gains and applications for high?throughput scenarios.

Why Communications Needs Digital Twin Technology

Explains digital twin concepts and architecture for communication networks, detailing virtualized twin components, simulation-based optimization, and closed-loop operation.

5G Capital Addresses 5G-A Deployment Challenges

Technical summary about China Unicom's 5G-A trials and Beijing large-scale demo, detailing 10 Gbps downlink peak, audiovisual use cases, and deployment challenges.

South Korea Dedicated 5G Spectrum: Current Use and Outlook

Technical summary of South Korea's policy and licensing for private 5G, detailing 28 GHz deployments, licensees, and enterprise self-deployment including Samsung.

High Thermal Conductivity Graphite Films and Thermal-Grade Polyimide Processes

Technical overview of graphite film for electronics: types, production processes, industry chain and role of thermal-grade polyimide in high-conductivity heat dissipation.

What Is Link Aggregation and Its Benefits?

Technical overview of link aggregation and LACP, covering static vs dynamic aggregation, LACP operation and timeouts, benefits, and common use cases.

Qualcomm's Five Key Technologies in 5G Advanced Release 18

Summary of Qualcomm's Release 18 contributions to 5G Advanced: uplink and broadband enhancements, IoT extensions, efficient system design, and wireless AI foundations.

Understanding 5G RedCap Technology

MIIT roadmap for 5G RedCap: standard evolution, industrial ecosystem and city-level coverage by 2025, enabling scalable RedCap applications in industry and IoT.

ADI Vital Signs Monitoring Signal-Chain Solutions

White paper detailing ADI wearable signal-chain solutions for vital-sign monitoring, covering PPG, ECG, impedance, multi-parameter AFEs and 20 recommended components.

Qorvo Low-Power PMIC for Medical Wearables

Overview of PMIC design for compact wearables, comparing Qorvo's ACT81460 and Maxim's MAX20310; emphasis on low quiescent current, SIMO topology, and small WLCSP/WLP packages.