Why the Inductor Is the Hard Part in Buck Converters
Analysis of key components in a buck converter, focusing on why the inductor selection and inductance calculation pose the primary design challenge.
Analysis of key components in a buck converter, focusing on why the inductor selection and inductance calculation pose the primary design challenge.
Technical overview of silicon carbide substrate production comparing PVT, liquid-phase and HTCVD crystal growth methods, challenges and advances in scaling low-defect wafers.
RF power amplifiers and LNAs explained: boost range, improve signal quality, and enable compact FEMs for Wi?Fi and cellular.
Guide to silicon NPN transistors: structure, operation, key parameters, temperature effects, naming, packaging and selection tips.
Analysis of non-discharging RCD snubber design for SiC MOSFETs: CSNB/RSNB selection, surge clamping, reduced ringing, and effects on switching loss and efficiency.
Explore high-frequency resistor types, parasitic equivalent models and RF impedance behavior for SMD thin-film resistors, including resonance effects.
Technical overview of MOSFET UIS avalanche ratings and SOA, covering Ipk vs tav behavior, thermal and die-volume limits, non-thermal failures, and repeated-avalanche effects.
Practical overvoltage protection: TVS diode selection, PTC coordination, and active disconnect circuits to protect power supplies.
Explore practical MOSFET applications in electronic circuits, including level shifting, switching, and reverse polarity protection.
Explains how an inverting amplifier's low input impedance (equal to Rin) and source internal resistance reduce closed-loop gain, causing gain error and instability.
Overview of NTC thermistor applications: oxide semiconductor temperature sensor whose resistance drops with rising temperature, used for thermal monitoring and control.
Summary of common diode applications in LDO circuits: reverse-connection protection, GND isolation, input-output clamping, and output drop/backfeed prevention.
Technical overview of NTC thermistor characteristics, resistance–temperature behavior, sensitivity, size and range, applications and temperature measurement methods (bridge, MCU).
Technical overview of bipolar junction transistor operation, structure, modes (cutoff, active, saturation), characteristic curves, and key parameters like current gain.
Technical overview of power MOSFET equivalent circuits, steady-state Rds(on) behavior, turn-on/turn-off dynamics, and diode reverse-recovery switching characteristics.
High-speed digital design guide: transmission lines, impedance, termination, crosstalk, losses, ground bounce and PCB techniques for signal integrity
Compare SiC MOSFETs vs Qorvo's integrated common-source/gate SiC FETs - lower losses, faster switching, higher efficiency for EVs and power systems
Technical summary of silicon carbide (SiC) power devices: wide bandgap advantages, thermal and voltage benefits, manufacturing challenges, EV and renewable energy applications.
Operational amplifier (op amp) overview: key characteristics, inputs, negative feedback, and practical tips for analog circuit design.
Technical overview of GaN advantages, the challenges of producing P-type GaN, and implications for device design, thermal scaling, and alternatives (SiC).