Inductor Overheating: Troubleshooting Steps

Switch-mode regulator troubleshooting: inductor overheating and unstable SW traced to inappropriate output capacitor ESR; replacing with ceramic/tantalum restored loop stability.

Silicon Carbide Power Devices: Operation and Applications

Technical overview of silicon carbide (SiC) power devices: operation, benefits, applications, challenges and future trends for high-temperature, efficient power electronics.

4 Types of MOSFET Gate Drive Circuits

Overview of MOSFET drive topologies: power IC direct, push-pull, accelerated turn-off and isolated transformer drives, with gate drive considerations and component guidance.

Comparison of SiC MOSFET, SJ-MOSFET and IGBT Performance

Technical comparison of SiC MOSFETs and Si SJ-MOSFETs covering material properties, static characteristics, RDS(ON) behavior, thermal and switching trade-offs.

GeSi SPAD Devices: Concept and Benchmark

Room-temperature, CMOS-compatible GeSi SPAD with 19 kHz μm?2 DCR, 12% PDE at 1310 nm and 188 ps jitter, validated in direct-TOF LiDAR imaging.

Power MOSFET Forward and Reverse Conduction Circuits

Technical overview of power MOSFET equivalent circuits, steady-state Rds(on) behavior, turn-on/turn-off dynamics, and diode reverse-recovery switching characteristics.

Capacitive Reactance: Three Practical Examples

Explains capacitive reactance (XC), its frequency dependence, formula XC = 1/(2πfC), and use in RC networks and passive low?pass/high?pass filters.

SiC Power Devices: Key Advantages and Technical Challenges

Technical summary of silicon carbide (SiC) power devices: wide bandgap advantages, thermal and voltage benefits, manufacturing challenges, EV and renewable energy applications.

Is Current-Sense Resistor Selection Simple?

Examines trade-offs in selecting a current-sense resistor: voltage drop, IR loss, self-heating and TCR effects, plus strategies to optimize accuracy and heat dissipation.

Design of Non-Discharging RCD Snubber for SiC MOSFET

Analysis of non-discharging RCD snubber design for SiC MOSFETs: CSNB/RSNB selection, surge clamping, reduced ringing, and effects on switching loss and efficiency.

BJT Structure and Operating Principles

Technical overview of bipolar junction transistors (BJT): structure, NPN/PNP configuration, current relationships, operating states, and implications for amplification and switching.

MOSFET vs IGBT: Key Differences

Comparison of MOSFET and IGBT power switches: structural differences, on-resistance, switching frequency limits, body diode behavior, and typical application use cases.

What Is an NTC Thermistor: Principle and Uses

Overview of NTC thermistor applications: oxide semiconductor temperature sensor whose resistance drops with rising temperature, used for thermal monitoring and control.

Understanding Bipolar Junction Transistors

Technical overview of bipolar junction transistor operation, structure, modes (cutoff, active, saturation), characteristic curves, and key parameters like current gain.

Metal Oxide Varistor (MOV) Aging and Protection Options

Technical overview of MOV aging mechanisms and protection strategies: parallel and series use with ceramic gas discharge tube (GDT) for improved surge protection and longevity.

Why GaN Is Seen as the Next Major Semiconductor

Technical overview of GaN advantages, the challenges of producing P-type GaN, and implications for device design, thermal scaling, and alternatives (SiC).

Understanding MOSFET Datasheet Parameters

Technical guide to reading a MOSFET datasheet, focusing on SOA curve interpretation, practical current limits (continuous and pulse), and relevance of switching parameters.

Power MOSFET UIS/UIL Behavior and Limits

Technical overview of MOSFET UIS avalanche ratings and SOA, covering Ipk vs tav behavior, thermal and die-volume limits, non-thermal failures, and repeated-avalanche effects.

SiC Power Device Interconnect Techniques

Review of SiC power device interconnects, covering planar, 3-D and hybrid techniques, impacts on parasitic inductance and thermal management, and key material/process challenges.

Why the Inductor Is the Hard Part in Buck Converters

Analysis of key components in a buck converter, focusing on why the inductor selection and inductance calculation pose the primary design challenge.