3 Classic Op Amp Circuit Analyses

Guide to op amp circuits: using virtual short to analyze inverting, noninverting, summing and balanced summing amplifiers with practical examples.

Understanding AGND and DGND Grounding Practices

Practical grounding and decoupling guide for mixed-signal systems covering ground plane, AGND/DGND strategies, PCB layout, and ADC/DAC clock and return-path issues.

ESD Implementation Strategies for Amplifier Inputs

Guide to internal ESD diodes and overvoltage protection for amplifier inputs, covering diode topologies, current limiting, thermal effects, and electromigration.

Crystal Oscillator Operation and Load Capacitor Selection

Practical engineering guide to Pierce oscillator design: crystal equivalent model, load capacitance tuning, startup/gain margin checks, drive-level and PCB layout recommendations.

How to Choose Inductors: Common Parameters

Technical guide to inductors and inductance: covers permeability, resistance, core loss, saturation, self-resonant frequency, ripple and selection for DC/DC converters.

MOSFET Gate Driver Circuit Design

Overview of MOSFET gate drive principles, gate-to-source capacitance and gate charge, threshold behavior, and gate charge calculation for driver circuit design.

China SiC Substrate Prices Fall in 2024; 800V Adoption Nears

Analysis of China SiC substrate price decline in 2024: domestic prices plunged vs global quotes, driven by capacity expansion, competition and potential price war.

What Is Diode Clamping? Applications of Clamping Protection

Overview of diode clamp and clamping circuit operation, positive/negative and bias clamps, RC time-constant design, component selection, and protection applications.

Understanding MOSFET Parameters

MOSFET technical summary of electrical and thermal specs: key ratings (VDSS, VGS, ID), thermal resistance RθJA and Tj calculation, capacitances, gate charge and switching timings.

Common Diode Uses in LDO Circuits

Summary of common diode applications in LDO circuits: reverse-connection protection, GND isolation, input-output clamping, and output drop/backfeed prevention.