I have a 2-up panel measuring about 8" x 8" with a score for depanel throuch the middle. I see warping after reflow of the panel (bending in/about score line). The board is not framed (i.e., supported) during SMT reflow other than on the conveyor thru the reflow. Will this caused me difficulties in soldering fine pitch (<20 mil) packages?
Berger
2017/2/3 13:49:14
I think you are a genuis. The idea in your post is quite helpful and lights me. I have been puzzled for a long time in my new project.
bruno.bellini
2017/2/3 13:49:14
An interesting post.
Francisco Mesa
2017/2/3 13:49:14
I like checking your post and hope your update comes soon.
akira
2017/2/3 13:49:14
It is very interesting and helpful.I will keep check your post.