Category:Electronic Components Packaging Technology

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Heat Sink for QFP Reply 2017-02-27 23:54:03
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david.rambeau.tea

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Hi. We are designing in a 128 pin LQFP that has a heat sink in the center of the package. The size of this is 7.44 by 7.55 mm.
Can anyone recommend what pad size should be on the board for this? How about stencil aperture/pattern?
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giovanni.ortali

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Csaba Simon

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Christever Rosario

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Remarkable.

Oguz AGCELI

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Excellent!
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