Hi , The 4th stage in reflow soldering, the cool-down, I find is often over looked. A rapid cooling rate should give finer lead and tin structure with more bindings and thereby result in stronger solder joints. Can anybody give me some information concerning the recommended and maximum cooling rate. Thanks!
fernando.eulate
2017/3/3 6:19:36
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Daniel
2017/3/3 6:19:36
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Charlie Laub
2017/3/3 6:19:36
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bruno.bellini
2017/3/3 6:19:36
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