My Message
Suggestions
1. Spec references for max allowable untinned gold near glass seal and case body?
2. Low cost mechanical dip system to facilitate tinning of DIP parts.
(Low volume; currently using hand solder iron techniques to allow for max coverage without bridging to case; attempts at hand dipping into small solder pots resulted in a combination of solder bridging to case and irregular tinning of leads.)
Tayfun Karan
2017/3/2 5:18:41
very useful informations.
Enrico Gensale
2017/3/2 5:18:41
Great work. I really appreciate it.
Ciro Veneruso
2017/3/2 5:18:41
Marvelous post. Appreciate it very much.
Carr
2017/3/2 5:18:41
Marvelous post. Appreciate it very much.
Anton Forosenko
2017/3/2 5:18:41
It help me a lot. Thank you.