Nowadays, multilayer PCBs are used in most high-speed circuit systems and lots of circuit systems have numerous operating powers, providing strict requirements to image planes design, especially the settlement of relationships between multiple power/ground planes. Besides, special copper clad surface needs to be designed on device layer design in order to stop oscillators from producing RF (radio frequency) energy and provide excellent heat dissipation for high power components.
uooa
2017/2/4 5:43:41
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