SMTA China Announces 2012 Paper Awards

2017/1/31 22:34:13

SMTA China announced the Best and Excellent Paper and the Best and Excellent Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China Annual Breakfast Reception and Recognition Ceremony, which took place on April 26, 2012 at the Shanghai Expo Intercontinental Hotel during NEPCON China in Shanghai.
May Yan of Cisco Systems Ltd. was awarded the Best Paper of Technology Conference One (CE12) for the paper “Discussion on CU Dissolution in PB-Free PTH Rework”.
Flextronics Industrial (Zhuhai)Co., Ltd.’s Carl Cai received the Excellent Paper of Technology Conference One (CE12)for the paper “Cycle Time Prediction and UPH Driving Methodologies Study for Fast Capacity Ramp Up”.
Henley Zhou, Flextronics Industrial (Zhuhai) Co., Ltd., received The Best Paper of Technology Conference Two (CE12) for “Asolution for BGA Underfill Partial Cured Issue and Coverage Issue”.
IST-Integrated Service Technology Inc.’s Cherie Chen was awarded the Excellent Paper of Technology Conference Two (CE12) for the paper“The Surface Finish Effect on Creep Corrosion of PCB”.
Jason Chan of Kyzen was awarded the Best Presentation of Technology Conference One (CE12) for the presentation “Cleaning Highly Dense Circuit Assemblies”.
Cisco Systems Ltd.’s Xia Chuan received the Excellent Presentation of Technology Conference Two (CE12) for the presentation “Evaluation of an Alternative PB-Free Alloy Used in Wave Soldering Process”.
Henley Zhou, Flextronics Industrial (Zhuhai) Co., Ltd., was awarded the Excellent Presentation of Technology Conference Two (CE12) for the presentation “A solution for BGA Underfill Partial Cured Issue and Coverage Issue”.
Heraeus Zhaoyuan (Changshu) Electronic Materials Co., Ltd.’s Dai Peng received the Best Presentation of Vendor Conference One (CE12) for “Heraeus Products for High Reliability Application in Electronics”.
Sunny Mu of Cookson Electronics-Enthone was awarded the Best Presentation of Vendor Conference Two (CE12) for the presentation “Considerations for the Long Term Reliability of PCBs in Harsh Environmental Conditions”.
OK International’s Paul Wood received the Best Presentation of Vendor Conference Three (CE12) for the presentation “Challenges of Rework on Micro BGAs”.
The Best Emerging Exhibit of the Year 2012 China East award went to CyberOptics for its SE500 ULTRA solder paste inspection system.
The award for Best Exhibit Technology of the Year 2012 China East went to Assembléon Asia Ltd. for its iFlex high-precision flexible pick-and-place machine.

Dan

2017/2/2 22:34:13

Very valuable!

Miguel Angel

2017/2/2 22:34:13

Appreciate your sharing.Please keep up your updates.

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