Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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Search Results: 100 Threads,10 Pages
5 answers
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Requirements for BGAs

Does anybody have information on the minimum spacing required between BGAs (i/o counts close to 696)to avoid damage during rework? Also, on the keep out requirements between CSPs (o.5 mm pitch); betwe... (See More)

Esteban
2017-02-02 05:35:24
kasemkwang
2017-02-04 05:35:24
5 answers
138 views

BGA and Land Patterns

What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? (See More)

Gabe
2017-02-02 05:19:40
Luigi Salvatore
2017-02-04 05:19:40
5 answers
159 views

Re-Balling BGA and BGA sockets

Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/... (See More)

frmendozat
2017-02-02 05:06:01
Burton
2017-02-04 05:06:01
5 answers
39 views

BGA Reliability

I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. The part is 1.77" square with a 50 mil pitch and 30 mil bu... (See More)

canerdurmusoglu
2017-02-02 05:01:16
n0xas
2017-02-04 05:01:16
4 answers
169 views

BGA step by step

I need know the types, characteristic specials for temperature, general characteristics and all I need know about of manufacturer for BGA. I Hope than you send my information about this. (See More)

etb2.binsbergen
2017-02-02 04:51:21
Franco Piccirelli
2017-02-04 04:51:21
5 answers
71 views

mirco bga stencil

Hi all, Any stencil opening recommendation for 20mils pitch mirco BGA. Currently, using 12mils round opening, 5 mils thickness. Seen to have weak joints as it crack after Ict testing. (See More)

Carey
2017-02-02 02:12:09
Eric Flores Solis
2017-02-04 02:12:09
5 answers
70 views

BGA ball and PCB pad

Hi all, These days our customer asks us to figure out ,during reflow,the BGA ball and solder paste,which will first melt? I think it's very hard to get the rusult.coz I think it'll vary at diffrent pa... (See More)

Boyd
2017-02-02 01:19:00
Clyde
2017-02-04 01:19:00
5 answers
133 views

BGA, stress on the PCB

I've a problem with a BGA. I've the impression that the balls broke then there is a too big mecanical stress on the PCB. I lost some dBm and when I press on the BGA I measure the good value! It's like... (See More)

Brady
2017-02-02 01:10:40
kementze19
2017-02-04 01:10:40
5 answers
63 views

Solder Paste to Device (BGA) or PCB

Can anybody tell me which is better; to paste to BGA or to paste to PCB? What are the pitfalls when pasting to BGA? (See More)

Adair
2017-02-02 01:07:46
ingcaschera
2017-02-04 01:07:46
5 answers
203 views

High Volume BGA re-balling

Hello all: We looking for an effective solutions for HIGH-VOLUMN BGA RE-BALLING. (i.e. cases where we got to scrap thousands of BGA modules and re-use the chip) BGA spec. (general) W: 8mm,... (See More)

Boyce
2017-02-02 01:05:40
Yucel Calik
2017-02-04 01:05:40
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