Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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5 answers
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Thermal Relief BGA pad design traces

Is there some good resources (.pdfs, websites, articles) that someone can point me to regarding design for bga footprints? I need to brush up on thermal relief design for bga footprints. I got a custo... (See More)

Holger S.
2017-02-02 18:52:22
Cliff
2017-02-04 18:52:22
2 answers
213 views

BGA Rework Stations

SV550 BGA Rework Station SV560 High Resolution System PCB-112 Full Auto System. BSY-860 BGA Rework Station Precision PCB Services, Inc. announced that it w... (See More)

michal.kozlok
2017-02-02 18:38:32
Yucel Calik
2017-02-04 18:38:32
2 answers
61 views

Rocket EMS Adds Large BGA Rework Capability

AIR-VAC DRS27 Large Format BGA Rework Station. Rocket EMS Inc., a Silicon Valley-based full service EMS supplier, today announced it has further enhanced its already impressive rework and specia... (See More)

greynaga
2017-02-02 17:13:25
GABRIEL SILVA
2017-02-04 17:13:25
4 answers
61 views

Paper Reballing Preforms

Does anyone have any "tricks" for getting all of those little pieces of paper removed from the pad/ball side of a BGA after reballing. We are using the paper preforms and there are lots of those littl... (See More)

Bowen
2017-02-02 14:48:00
wolffdp
2017-02-04 14:48:00
4 answers
38 views

Microscope for looking at BGA cross section.

Can anyone recommend a good reasonably priced microscope for looking at cross sections? The ones I'm finding with the magnification we're looking for all seem to be for glass slides. (See More)

Balazs Szucs
2017-02-02 14:13:59
Peter Sleeman
2017-02-04 14:13:59
3 answers
148 views

RoHS Solder Paste

Hi, we're currently running a design with a fairly simple BGA. The problem we're running into is poor solderability (cold looking joints, high voiding in the BGA). All of this on a know good oven, wit... (See More)

wolffdp
2017-02-02 13:07:19
ernesto
2017-02-04 13:07:19
4 answers
215 views

bga warp

Hi, I encountered a problem with pbga. One edge either warp downwards or upwards creating bridging or open. This bga have fr4 at the bottom (compound molding at the top). The fr4 is bigger than ... (See More)

robladanyi
2017-02-02 09:16:38
Andy
2017-02-04 09:16:38
3 answers
214 views

Recommended max board for BGA repair

Does anyone have suggestions or observations on what my maximum board temperature should be when doing BGA repairs on an SRT? In other words, How hot is too hot? Somebody set the bottom he... (See More)

ENRICO BORSETTI
2017-02-02 08:40:32
dmtan90
2017-02-04 08:40:32
3 answers
212 views

BGA Device with Slanted and Damaged Spheres

We have a ceramic BGA that the component supplier has misaligned the spheres in the fixture so they slant .007" out of alignment from the substrate pads. When the devices are tested at the component m... (See More)

kalman.kovacs
2017-02-02 08:04:28
Greg Smart
2017-02-04 08:04:28
5 answers
140 views

Reliability of BGA

Our design team is trying to change QFP into BGA. Does anyone have experience wavesoldering PCB with 0.5" pitch BGA's on the top side? What kind of problem will occure? Any advice is appreciated. (See More)

Esteban
2017-02-02 05:47:19
Chapman
2017-02-04 05:47:19
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