Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA Repair Problems

Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on th... (See More)

Sergey Alexandrovich
2017-02-28 13:42:29
Ciurdar Gabriel
2017-03-02 13:42:29
3 answers
183 views

Suspect BGAs

We are having a small number (~2%) of our boards pass our manufacturing diagnostics, fail once they reach the customer, fail when they get back to us and then start working again after handling them f... (See More)

charlene
2017-02-28 06:31:14
David Russell
2017-03-02 06:31:14
5 answers
81 views

BGA rework stations

if anyone has used or has one of these bga rework stations please give me your opinion on them. I am planning on using the sytem for not only rework but also low volume prototype production for hand b... (See More)

Peter Sleeman
2017-02-28 05:55:39
Bruce
2017-03-02 05:55:39
5 answers
159 views

Help! Could anyone help to enlighten me on this?

Hi, Help! Could anyone help to enlighten me on this? Question: If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum... (See More)

pepe_ciro
2017-02-28 05:53:33
Conrad
2017-03-02 05:53:33
5 answers
110 views

BGA warpage

I have received prototype PBGA (256 pins) devices from Motorola (actual part number = KXPC850ZT50). These parts seemed very warped on the edges. When I put the part on a plain surface, it rocks quite ... (See More)

Andy
2017-02-28 05:40:02
Roberto Dias
2017-03-02 05:40:02
5 answers
170 views

BGA substrate pad alloy

Is there a typical alloy used by vendors on the substrate pad? What is their process used to attach a eutectic ball to that pad? Thanks. (See More)

rownickijan
2017-02-28 04:39:21
gilfredo_aguilar
2017-03-02 04:39:21
4 answers
125 views

BGA Failure in ENIG process

We started our first ENIG process recently and to our surprise, we have many failure on the one and only BGA on the board. The BGA is a 31 mils pitch plastic. Sending the PCBA to 1 cycle of heating/co... (See More)

javierdiazespana
2017-02-28 04:20:45
luizleo2001
2017-03-02 04:20:45
5 answers
183 views

local fiducials to improve BGA placement?

Looking for any insight into whether the use of local fiducials will help or eliminate component recognition issues. (See More)

gcostache2001
2017-02-28 04:16:54
Simone Briatore
2017-03-02 04:16:54
4 answers
178 views

minimum X-Ray machine capability

Dear all I 'm looking the minimum X-Ray machine capability that is capable to inspect the solder joint of BGAs, Fine pitch BGA and CSP such as open, poor solder joint ,etc... What is the machine speci... (See More)

babinyecz
2017-02-28 03:56:18
Mario1971
2017-03-02 03:56:18
5 answers
174 views

When is BGA Reballing not recommended?

Hi, We are experimenting with BGA recovery and we would like to know When is BGA Reballing not recommended? (See More)

superble
2017-02-28 03:01:31
Anton Forosenko
2017-03-02 03:01:31
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