Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA Rework Reply 2017-05-21 02:28:40
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reilhacpierre

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Looking at purchasing an inexpensive BGA rework machine. Saw Weller's BGA system (model 3000) a few months ago . . . seemed to work Ok. Now that I am ready to buy, read on one of their resellers website that this model is being discontinued. I am apprehensive about contacting Weller directly as I doubt that they will give me a straight answer.
Problem: even if some are available, don't want to be stuck with a discontinued machine (service and spares will like be problematic). Does anyone know if they are coming out with a new model or are they removing this product line altogether?
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henry.kjonsberg

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Marvelous post. Appreciate it very much.
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