Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA rework Reply 2017-05-09 22:42:07
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Javier Martínez

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As you are aware the common method to rework BGA is : 1. Remove BGA with hot air reflow machine ( SRT as current practice) 2. Clean the BGA pad using solder iron and solder wick. 3. Replace BGA with SRT rework machine.
The problem we have with unplug via is when we clean the BGA pad, the solder resist cover the trace between pads and vias will be removed. During the solder removal process certain amount of solder will also get into the unplug vias as well. During BGA replacement process, two thing will happen. First, due to vias plug with solder, explosion might happen and cause solder short or open. Second, due to the solder resist has been removed, the solder from BGA ball will flow into the vias and cause insufficient or unsolder BGA balls.
I would like to hear any one have any process that could take care of such problem.
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Winnie

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My favorite psot here. It's very impressive and helpful.
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