Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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how critical is the Micro BGA baking? Reply 2017-03-01 03:06:24
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Bruce

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Hello Friends, Please advise how critical is the Micro BGA baking? The BGA size is around 7x7mm and we need to program it before mounting. The Micro BGA's are supplied in Trays and are put in to tape and reel after programming.We need to put these BGA's in to tape and reel due to Pick and place machine limitation. The Micro BGA's are 32 mils pitch and 10mils dia.
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olah.mihaly

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Thanks for the article. Very valuable.
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