Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA,S Reply 2017-03-01 02:54:35
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hgp

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Dear All :
1- We assemble mixed technology boards. For some reasons, sometimes we store them semi assembled (only SMT). Knowing that they have plastic BGA,s , can the wave solder m/c affect or damage those BGA,S on continuation their production?
If yes, then how to avoid ?
2- Also when repairing boards with BGA,S , how to avoid damaging the BGA,s while removing ? I mean some damages like buckling & I am interested because we have to reball them again for reuse.
Best regards
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Mikel Rodriguez

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I appreciate your article very much. Wait for your next writing.
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