Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA warpage Reply 2017-02-28 05:40:02
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Andy

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I have received prototype PBGA (256 pins) devices from Motorola (actual part number = KXPC850ZT50). These parts seemed very warped on the edges. When I put the part on a plain surface, it rocks quite a bit when I press lightly on a corner. I have had intermittent problems with the pins on the corners. How can I mesure if the level of warpage is acceptable ? What measures can I take to minimize the effect of this warpage.
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Michele Deligio

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Remarkable.I have learned a lot from your post.

Roberto Dias

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It answered all my puzzles.Very helpful.

William Paul

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It answered all my puzzles.Very helpful.

hobbydepot.my

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Sergey Alexandrovich

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Awesome post. Like it very much.
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