Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA rework stations Reply 2017-02-28 05:55:39
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Peter Sleeman

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if anyone has used or has one of these bga rework stations please give me your opinion on them. I am planning on using the sytem for not only rework but also low volume prototype production for hand built 1 or 2 qty pcb's, so ease of use is important to me.
SRT Serria Summit 1000 Air Vac DRS22 Air Vac DRS22C (not sure what the difference between the DRS22 & DRS22C?)
thank you
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Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

PAWEL WYSZYNSKI

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Excellent work. I am impressed.

Bruce

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Remarkable.Great help to my learning.

Christopher

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I will keep on reading your sharing. Thats really interesting and helpful.

Aubrey

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Keep your sharing like this. You have made a nice post and I really learned a lot from you. It will help me work out my new project.

Enrico Alessi

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Great work. I really appreciate it.
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