Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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Help! Could anyone help to enlighten me on this? Reply 2017-02-28 05:53:33
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pepe_ciro

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Hi,
Help! Could anyone help to enlighten me on this?
Question:
If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water clean washing machine that able to effective performing the cleaning on component's bumps after attachment on PCB? ( Assume that water pressure is 60 PSI)
Thank you in advance!
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Robert Fransson

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Very impressive posting. Thank you for your efforts.

Conrad

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Quite useful and impressive info.

Factor

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Very valuable!

Chris Bethea

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Interesting and useful!

Sebastian Charlak

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Keep your sharing like this. You have made a nice post and I really learned a lot from you. It will help me work out my new project.
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