Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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local fiducials to improve BGA placement? Reply 2017-02-28 04:16:54
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gcostache2001

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Looking for any insight into whether the use of local fiducials will help or eliminate component recognition issues.
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Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

Bleacher

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Simone Briatore

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Sergio Sota Ortega

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Tsvetan

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Stefano Vittorio

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