Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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Could anyone advise what BGA rework rate? Reply 2017-02-28 01:17:45
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Tsvetan

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Could anyone advise what BGA rework rate we should expect with product that has 4 BGAs (224 pins, 196 pins, 160 pins, 48 pins). Negative factor is that we have old and tired pick & place - Panasonic MPA-G1 or MPA-V without AOI.
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Broderick

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Henri Aroyan

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Ibrahim ARI

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M.?Aznar

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