Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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Voids found Reply 2017-02-28 22:56:33
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Luc Vercruysse

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Hi,
We found voids on BGA. Understand IPC stated as long as not more than 25% should be fine. So, is there any standard stated how many voids in BGA can be allow. Appreciate your help......
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