Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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solder bridging under one corner of BGA Reply 2017-02-28 20:20:44
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Waelson Negreiros

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Any one got experience on handling solder bridging under one corner of BGA?

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Blithe

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Please keep us up to date like this.

Andreas Jonsson

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Very valuable!

Christever Rosario

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Remarkable.

cgr-pcb

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Like this post very much.
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