Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA x-ray Reply 2017-02-28 17:55:12
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erhanarslan75

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Hi All,
We have a glenbrook x-ray in house, but I am in need of a high resolution x-ray of some failed BGA image sensors.
Does anyone know of a company that does hi-res or 3D x-ray service? We are not getting enough detail to really see what may be going wrong with one of our assemblies.
thanks!
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jackheaton

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very useful informations.

Nigel Nichols

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I appreciate your article very much. Wait for your next writing.

zakbc

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This post is really interesting.
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