Category:Electronic Components BGA

Group Administrators: 1 | Group Member: 95 | Group Threads: 100

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Thread Reply
Samsung SM482 and BGA Reply 2017-02-28 14:22:33
150 views
3 comments
16 likes

azhar

Leave A Message

Follow

Ive been using a Samsung sm482 for about 2 years and recently got the heads up that we will be getting a project soon with a BGA chip. Im wondering if anyone on here uses the SM482 for BGA and if so, can offer any advice. Feeling a little worried about it.
We will also be using a Manncorp MC1400 stencil printer for the solder stenciling
Thank you in advance for advice and help!!!!!
16 likes
Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

Paul Cunnane

Leave A Message

Follow

This post is really interesting.

Oguz AGCELI

Leave A Message

Follow

Very valuable!

enrico.beccati

Leave A Message

Follow

Marvelous posting.
ThreadReply