Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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New BGA Rework Station Reply 2017-02-27 18:51:25
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fravillama

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Today, Precision PCB Services, Inc. will like to introduce the first BGA Rework Station that has our name on it. Announced Lan Ngyyen, President. The model PCB-112 is a fully automated High Resolution Split Vision System that will perform as will if not better than the leading BGA Rework Stations, and at a fraction of the price. Our goal is to make our new line of BGA Rework Stations the new Industry Standard. In 2015, we plan to have a complete line of BGA Rework Systems, Support Equipment, Tools and Supplies. All backed by our companies 23 years of experience in the electronics industry, and our team of veteran BGA Rework Engineers.
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pmaggi

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Awesome post. Like it very much.

John Inlow

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Like this post very much.
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