Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA, uBGA and FP BGA Reply 2017-02-27 06:36:50
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weijie

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Are the terms "uBGA" and "Fine Pitch BGA" synonomous, different all-together, or is Fine Pitch BGA a subset of uBGA? Thanks.
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Broderick

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Have marked your post. Keep on your great job. Hope your next writing soon.

weijie

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This post is perfect for what I need. Thanks!

Markus Schmitz

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Glad to read such a marvelous article here. You are a genius.

Ivan Dario

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Interesting and useful!

Berg

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Nice content you’ve posted in here
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